Publications

Journal Papers

H. Yu and T. Chi, “A Systematic Approach to Designing Broadband Millimeter-Wave Cascode Common Source with Inductive Degeneration Low Noise Amplifiers,” accepted and to appear in IEEE Trans. Circuits Syst. I, Reg. Papers (T-CAS I).
X. Zhang, S. Li, D. Huang, and T. Chi, “A Millimeter-Wave Three-Way Doherty Power Amplifier for 5G NR OFDM,” accepted and to appear in IEEE J. Solid-State Circuits (JSSC).
F. Ahsan, T. Chi, S. Sheth, W. Goodman, and B. Aazhang, “EMvelop Stimulation: Minimally Invasive Deep Brain Stimulation Using Temporally Interfering Electromagnetic Waves,” J. Neural Eng., vol. 19, no. 4, July 2022.
Y. Fan, L. Zhang, Q. Zhang, G. Bao, and T. Chi, “An Integrated Microheater Array with Closed-Loop Temperature Regulation Based on Ferromagnetic Resonance of Magnetic Nanoparticles,” IEEE Trans. Biomed. Circuits Syst. (T-BioCAS), vol. 15, no. 6, pp. 1236–1249, Dec. 2021.
W. Schmid, Y. Fan, T. Chi, E. Golanov, A. Golanov, R. Austerman, K. Podell, P. Cherukuri, T. Bentley, C. Steele, S. Schodrof, B. Aazhang, and G. Britz, “Review of Wearable Technologies and Machine Learning Methodologies for Systematic Detection of Mild Traumatic Brain Injuries,” J. Neural Eng., vol. 18, no. 4, Aug. 2021.
Y. Hu and T. Chi, “A 27–46-GHz Low Noise Amplifier With Dual-Resonant Input Matching and A Transformer-Based Broadband Output Network,” IEEE Microw. Wireless Compon. Lett. (MWCL), vol. 31, no. 6, pp. 725–728, June 2021 (special issue of Top IMS2021 Papers, IMS Advanced Practice Paper Finalist).
S. Li, T. Chi, and H. Wang, “Multi-Feed Antenna and Electronics Co-Design: An E-Band Antenna-LNA Front End With On-Antenna Noise-Canceling and Gₘ-Boosting,” IEEE J. Solid-State Circuits (JSSC), vol. 55, no. 12, pp. 3362–3375, Dec. 2020.
L. Luan, J.-T. Robinson, B. Aazhang, T. Chi, K. Yang, X. Li, H. Rathore, A. Singer, S. Yellapantula, Y. Fan, Z. Yu, and C. Xie, “Recent Advances in Electrical Neural Interface Engineering: Minimal Invasiveness, Longevity, and Scalability,” Neuron, vol. 108, no. 2, pp. 302–321, Oct. 2020.
M.-Y. Huang, T. Chi, S. Li, T.-Y. Huang, and H. Wang, “A 24.5–43.5-GHz Ultra-Compact CMOS Receiver Front End With Calibration-Free Instantaneous Full-Band Image Rejection for Multiband 5G Massive MIMO,” IEEE J. Solid-State Circuits (JSSC), vol. 55, no. 5, pp. 1177–1186, May 2020.
J. Park, S. Grijalva, D. Jung, S. Li, G. Junek, T. Chi, H. Cho, and H. Wang, “Intracellular Cardiomyocytes Potential Recording by Planar Electrode Array and Fibroblasts Co-Culturing on Multi-Modal CMOS Chip,” Biosensors and Bioelectronics, vol. 144, Aug. 2019.
M.-Y. Huang, T. Chi, F. Wang, T.-W. Li, and H. Wang, “A Full-FoV Autonomous Hybrid Beamformer Array With Unknown Blockers Rejection and Signals Tracking for Low-Latency 5G mm-Wave Links,” IEEE Trans. Microw. Theory Techn. (T-MTT), vol. 67, no. 7, pp. 2964–2974, July 2019.
S. Li, T. Chi, J. Park, H. Nguyen, and H. Wang, “A 28-GHz Flip-Chip Packaged Chireix Transmitter With On-Antenna Outphasing Active Load Modulation,” IEEE J. Solid-State Circuits (JSSC), vol. 54, no. 5, pp. 1243–1253, May 2019.
S. Li, T. Chi, T.-Y. Huang, M.-Y. Huang, D. Jung, and H. Wang, “A Buffer-Less Wideband Frequency Doubler in 45-nm CMOS-SOI With Transistor Multiport Waveform Shaping Achieving 25% Drain Efficiency and 46–89 GHz Instantaneous Bandwidth,” IEEE Solid-State Circuits Lett. (SSCL), vol. 2, no. 4, pp. 25–28, Apr. 2019.
T. Chi, J. Park, S. Li, and H. Wang, “A Millimeter-Wave Polarization-Division-Duplex Transceiver Front-End With an On-Chip Multifeed Self-Interference-Canceling Antenna and an All-Passive Reconfigurable Canceller,” IEEE J. Solid-State Circuits (JSSC), vol. 53, no. 12, pp. 3628–3639, Dec. 2018.
H. Nguyen, T. Chi, S. Li, and H. Wang, “A Linear High-Efficiency Millimeter-Wave CMOS Doherty Radiator Leveraging Multi-Feed On-Antenna Active Load Modulation,” IEEE J. Solid-State Circuits (JSSC), vol. 53, no. 12, pp. 3587–3598, Dec. 2018.
E. T. Hardy, Y. J. Wang, S. Iyer, R. G. Mannino, Y. Sakurai, T. H. Barker, T. Chi, Y. Youn, H. Wang, A. C. Brown, and W. A. Lam, “Interdigitated microelectronic bandage augments hemostasis and clot formation at low applied voltage in vitro and in vivo,” Lab On a Chip, DOI: 10.1039/C8LC00573G, pp. 2985–2993, Aug. 2018.
J. Park, M. Aziz, S. Li, T. Chi, S. Grijalva, J. Sung, H. Cho, and H. Wang, “1024-Pixel CMOS Multimodality Joint Cellular Sensor/Stimulator Array for Real-Time Holistic Cellular Characterization and Cell-Based Drug Screening,” IEEE Trans. Biomed. Circuits Syst. (T-BioCAS), vol. 12, no. 1, pp. 80–94, Feb. 2018.
T. Chi, S. Li, J. Park, and H. Wang, “A Multifeed Antenna for High-Efficiency On-Antenna Power Combining,” IEEE Trans. Antennas Propag. (T-AP), vol. 65, no. 12, pp. 6937–6951, Dec. 2017.
S. Li, T. Chi, Y. Wang, and H. Wang, “A Millimeter-Wave Dual-Feed Square Loop Antenna for 5G Communications,” IEEE Trans. Antennas Propag. (T-AP), vol. 65, no. 12, pp. 6317–6328, Dec. 2017.
M. Huang, T. Chi, F. Wang, and H. Wang, “An All-Passive Negative Feedback Network for Broadband and Wide Field-of-View Self-Steering Beam-Forming with Zero DC Power Consumption,” IEEE J. Solid-State Circuits (JSSC), vol. 52, no. 5, pp. 1260–1273, May 2017.
M. Zia, T. Chi, J. Park, A. Su, J. Gonzalez, P. Jo, M. Styczynski, H. Wang, and M. Bakir, “3-D Integrated Electronic Microplate Platform for Low-Cost Repeatable Biosensing Applications,” IEEE Trans. Compon., Packag., Manuf. Technol. (T-CPMT), vol. 6, no. 12, pp. 1827–1833, Dec. 2016.
T. Chi, J. Park, J. Butts, T. Hookway, A. Su, C. Zhu, M. Styczynski, T. McDevitt, and H. Wang, “A Multi-Modality CMOS Sensor Array for Cell-Based Assay and Drug Screening,” IEEE Trans. Biomed. Circuits Syst. (T-BioCAS), vol. 9, no. 6, pp. 801–814, Dec. 2015.
T. Chi, J. Luo, S. Hu, and H. Wang, “A Multi-Phase Sub-Harmonic Injection Locking Technique for Bandwidth Extension in Silicon-Based THz Signal Generation,” IEEE J. Solid-State Circuits (JSSC), vol. 50, no. 8, pp. 1861–1873, Aug. 2015.

Conference Papers

X. Zhang, S. Li, D. Huang, and T. Chi, “A 38GHz Deep Back-Off Efficiency Enhancement PA with Three-Way Doherty Network Synthesis Achieving 11.3dBm Average Output Power and 14.7% Average Efficiency for 5G NR OFDM,” in Proc. IEEE RF Integrated Circuits Symp. (RFIC), June 2022. ― 2022 IEEE RFIC Best Student Paper Award Finalist
Y. Hu*, X. Zhang*, and T. Chi, “A 28GHz Hybrid-Beamforming Transmitter Array Supporting Concurrent Dual Data Steams and Spatial Notch Steering for 5G MIMO,” in Proc. IEEE Custom Integrated Circuits Conf. (CICC), Apr. 2021. (* Equally credited author) ― 2021 IEEE CICC Best Student Paper Award
Y. Fan, L. Zhang, Q. Zhang, G. Bao, and T. Chi, “An Integrated Thermal Actuation/Sensing Array with Stacked Oscillators for Efficient and Localized Heating of Magnetic Nanoparticles with Sub-Millimeter Spatial Resolution,” in IEEE Int. Solid-State Circuits Conf. (ISSCC) Dig. Tech. Papers, Feb. 2021, pp. 280–281.
Q. Zhou*, Y. He*, K. Yang, and T. Chi, “Exploring PUF-Controlled PA Spectral Regrowth for Physical-Layer Identification of IoT Nodes,” in IEEE Int. Solid-State Circuits Conf. (ISSCC) Dig. Tech. Papers, Feb. 2021, pp. 204–205. (* Equally credited author)
F. Ahsan, T. Chi, R. Cho, S. Sheth, W. Goodman, and B. Aazhang, “Non-invasive Deep Brain Stimulation using Electromagnetic Waves,” in Proc. 54th Asilomar Conf. on Signals, Systems & Computers, Nov. 2020.
S. Li, T. Chi, D. Jung, T.-Y. Huang, M.-Y. Huang, and H. Wang, “An E-Band High-Linearity Antenna-LNA Front-End with 4.8dB NF and 2.2dBm IIP3 Exploiting Multi-Feed On-Antenna Noise-Canceling and Gm-Boosting,” in IEEE Int. Solid-State Circuits Conf. (ISSCC) Dig. Tech. Papers, Feb. 2020, pp. 78–79.
M. Huang, T. Chi, F. Wang, S. Li, T. Huang, and H. Wang, “A 24.5-43.5GHz Compact RX with Calibration-Free 32-56dB Full-Frequency Instantaneously Wideband Image Rejection Supporting Multi-Gb/s 64-QAM/256-QAM for Multi-Band 5G Massive MIMO,” in Proc. IEEE RF Integrated Circuits Symp. (RFIC), June 2019.
S. Li, T. Chi, H. Nguyen, T. Huang, and H. Wang, “A 28GHz Packaged Chireix Transmitter with Direct On-Antenna Outphasing Load Modulation Achieving 56%/38% PA Efficiency at Peak/6dB Back-Off Output Power,” in Proc. IEEE RF Integrated Circuits Symp. (RFIC), June 2018. ― 2018 IEEE RFIC Best Student Paper Award (2nd place)
S. Li, H. Nguyen, T. Chi, C. Li, N. Cahoon, A. Kumar, G. Freeman, D. Harame, and H. Wang, “Performance of V-Band On-Chip Antennas in GlobalFoundries 45nm CMOS SOI Process for Mm-Wave 5G Applications,” in IEEE MTT-S Int. Microwave Symp. (IMS), June 2018.
T. Chi, J. Park, S. Li, and H. Wang, “A 64GHz Full-Duplex Transceiver Front-End with An On-Chip Multifeed Self-Interference-Canceling Antenna and An All-Passive Canceler Supporting 4Gb/s Modulation in One Antenna Footprint,” in IEEE Int. Solid-State Circuits Conf. (ISSCC) Dig. Tech. Papers, Feb. 2018, pp. 76–77.
H. Nguyen, T. Chi, S. Li, and H. Wang, “A 62-to-68GHz Linear 6Gb/s 64QAM CMOS Doherty Radiator with 27.5%/20.1% PAE at Peak/6dB-Back-Off Output Power Leveraging High-Efficiency Multi-Feed Antenna-Based Active Load Modulation,” in IEEE Int. Solid-State Circuits Conf. (ISSCC) Dig. Tech. Papers, Feb. 2018, pp. 402–403.
M. Huang, T. Chi, F. Wang, T. Li, and H. Wang, “A 23-to-30GHz Hybrid Beamforming MIMO Receiver Array with Closed-Loop Multistage Front-End Beamformers for Full-FoV Dynamic and Autonomous Unknown Signal Tracking and Blocker Rejection,” in IEEE Int. Solid-State Circuits Conf. (ISSCC) Dig. Tech. Papers, Feb. 2018, pp. 68–69.
H. Wang, S. Hu, T. Chi, F. Wang, S. Li, M. Huang, and J. Park, “Towards Energy-Efficient 5G Mm-Wave Links: Exploiting Broadband Mm-Wave Doherty Power Amplifier and Multi-Feed Antenna with Direct On-Antenna Power Combining,” in Proc. IEEE Bipolar/BiCMOS Circuits and Technology Meeting (BCTM), Oct. 2017. (Invited)
C. Li, M. Wang, T. Chi, A. Kumar, M. Boenke, D. Wang, N. Cahoon, A. Bandyopadhyay, A. Joseph, and H. Wang, “5G Mm-Wave Front-End-Module Design with Advanced SOI Process,” in Proc. IEEE Int. Conf. on ASIC (ASICON), Oct. 2017. (Invited)
T. Chi, H. Wang, M. Huang, F. Dai, and H. Wang, “A Bidirectional Lens-Free Digital-Bits-In/-Out 0.57mm2 Terahertz Nano-Radio in CMOS with 49.3mW Peak Power Consumption Supporting 50cm Internet-of-Things Communication,” in Proc. IEEE Custom Integrated Circuits Conf. (CICC), May 2017. ― 2017 IEEE CICC Best Paper Award
J. Park, M. Aziz, S. Gonzalez, D. Jung, T. Chi, S. Li, H. C. Cho, and H. Wang, “A CMOS 22k-Pixel Single-Cell Resolution Multi-Modality Real-Time Cellular Sensing Array,” in Proc. IEEE Custom Integrated Circuits Conf. (CICC), May 2017.
T. Chi, F. Wang, S. Li, M. Huang, J. Park, and H. Wang, “A 60GHz On-Chip Linear Radiator with Single-Element 27.9dBm Psat and 33.1dBm Peak EIRP Using Multifeed Antenna for Direct On-Antenna Power Combining,” in IEEE Int. Solid-State Circuits Conf. (ISSCC) Dig. Tech. Papers, Feb. 2017, pp. 296–297.
T. Chi, M. Huang, S. Li, and H. Wang, “A Packaged 90-to-300GHz Transmitter and 115-to-325GHz Coherent Receiver in CMOS for Full-Band Continuous-Wave Mm-Wave Hyperspectral Imaging,” in IEEE Int. Solid-State Circuits Conf. (ISSCC) Dig. Tech. Papers, Feb. 2017, pp. 304–305.
J. Park, M. Aziz, T. Chi, A. Su, A. Zhao, H. Cho, M. Styczynski, and H. Wang, “Live Demonstration: CMOS Multi-Modality Sensing Array for Drug Screening and Cell-Based Assays”, in Proc. IEEE SENSORS, Oct. 2016. ― 2016 IEEE SENSORS Best Live Demo Award (2nd Place)
S. Li, T. Chi, J. Park, and H. Wang, “A Multi-Feed Antenna for Antenna-Level Power Combining,” in Proc. IEEE Int. Symp. Antennas Propag. (APSURSI), June 2016.
J. Park, T. Chi, A. Su, C. Zhu, J. H. Sung, H. C. Cho, M. Styczynski, and H. Wang, “A High-Density CMOS Multi-Modality Joint Sensor/Stimulator Array with 1024 Pixels for Holistic Real-Time Cellular Characterization,” in Proc. IEEE VLSI Tech. Cir. Symp. (VLSI), June 2016.
M. Huang, T. Chi, and H. Wang, “A 5GHz All-Passive Negative Feedback Network for RF Front-End Self-Steering Beam-Forming with Zero DC Power Consumption,” in Proc. IEEE RF Integrated Circuits Symp. (RFIC), May 2016. ― 2016 IEEE RFIC Best Student Paper Award (2nd place)
S. Li, T. Chi, W. Tanveer, J. Papapolymerou, and H. Wang, “A Fully Packaged D-Band MIMO Transmitter Using High-Density Flip-Chip Interconnects on A Flexible LCP Substrate,” in IEEE MTT-S Int. Microwave Symp. (IMS), May 2016.
T. Chi and H. Wang, “A Scalable Active THz Frequency Multiplier Chain in Silicon with Multi-Phase Sub-Harmonic Injection Locking for Bandwidth Extension,” in IEEE Asia-Pacific Microwave Conf. (APMC), Dec. 2015. (Invited)
M. Zia, T. Chi, C. Zhang, P. Thadesar, T. Hookway, J. Gonzalez, T. McDevitt, H. Wang, and M. Bakir, “A Microfabricated Electronic Microplate Platform for Low-cost Repeatable Biosensing Applications,” in Proc. IEEE Int. Electron Devices Meeting (IEDM), Dec. 2015.
M. Zia, C. Zhang, P. Thadesar, T. Hookway, T. Chi, J. Gonzalez, T. McDevitt, H. Wang, and M. S. Bakir, “Fabrication of and Cell Growth on ‘Silicon Membranes’ with High Density TSVs for Bio-Sensing Applications,” in Proc. IEEE Biomedical Circuits and Systems Conf. (BioCAS), Oct. 2015.
J. Park, T. Chi, A. Su, C. Zhu, J. Butts, T. Hookway, T. McDevitt, M. Styczynski, and H. Wang, “Live Demonstration: A Multi-Modality CMOS Sensor Array for Cell-Based Assay and Drug Screening,” in Proc. IEEE Biomedical Circuits and Systems Conf. (BioCAS), Oct. 2015.
T. Chi, J. Papapolymerou, and H. Wang, “A +2.3dBm 124-158GHz Class-C Frequency Quadrupler with Folded-Transformer Based Multi-Phase Driving,” in Proc. IEEE RF Integrated Circuits Symp. (RFIC), May 2015.
W. Khan, A. Ulusoy, R. Schmid, T. Chi, J. Cressler, H. Wang, and J. Papapolymerou, “A D-band (110 to 170 GHz) SPDT Switch in 32 nm CMOS SOI,” in IEEE MTT-S Int. Microwave Symp. (IMS), May 2015.
J. Park, T. Chi, J. Butts, T. Hookway, T. C. McDevitt, and H. Wang, “A Multimodality CMOS Sensor Array for Cell-Based Assay and Drug Screening,” in IEEE Int. Solid-State Circuits Conf. (ISSCC) Dig. Tech. Papers, Feb. 2015, pp. 208–209.
H. Wang, A. Mohadavi, J. Park, T. Chi, J. Butts, T. A. Hookway, T. McDevitt, D. A. Tirrell, A. Hajimiri, “Cell Culture and Cell Based Sensors on CMOS,” in Proc. IEEE Biomedical Circuits and Systems Conf. (BioCAS), Oct. 2014.
F. Inanlou, W. Khan, P. Song, S. Zeinolabedinzadeh, R. Schmid, T. Chi, A. Ulusoy, J. Papapolymerou, H. Wang, and J. Cressler, “Compact, Low-Power, Single-Ended and Differential SiGe W-band LNAs,” in 44th European Microwave Conf. (EuMC), Oct. 2014.
T. Chi, J. Luo, S. Hu and H. Wang, “A Multi-Phase Sub-Harmonic Injection Locking Technique for Bandwidth Extension in Silicon-Based THz Signal Generation,” in Proc. IEEE Custom Integrated Circuits Conf. (CICC), Sept. 2014. ― 2014 IEEE CICC Best Student Paper Award Finalist
T. Chi, J. Park, R. L. Schmid, A. C. Ulusoy, J. D. Cressler, and H. Wang, “A Low-Power and Ultra-Compact W-band Transmitter Front-End in 90 nm SiGe BiCMOS Technology,” in Proc. IEEE Bipolar/BiCMOS Circuits and Technology Meeting (BCTM), Sept. 2014.
J. Park, T. Chi, and H. Wang, “An Ultra-Broadband Compact Mm-Wave Butler Matrix in CMOS for Array-Based MIMO Systems,” in Proc. IEEE Custom Integrated Circuits Conf. (CICC), Sept. 2013.